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Changdian Technology launches innovative power module packaging design solutions

Article Source：Changdian Technology Official WeChat | Author：Changdian Technology | Issuing Time：2024.03.22
Changdian Technology launches innovative power module packaging design solutions to improve the power supply performance of AI processors.

With the emergence of xPU for handling complex artificial intelligence (AI) functions, the power consumption of high-performance processors has sharply increased. In the deployment of large-scale machine learning and reasoning applications, there are billions of transistors in an AI chip package, and the novel capabilities of AIGC are constantly emerging. The demand for server rack power is also increasing exponentially. The power consumption of AI chips approaches kilowatts, and the current demand increases to thousands of amperes, becoming a limiting factor in computing performance. This puts higher requirements on power distribution, energy efficiency, packaging size, cost, and heat dissipation performance.

The new generation of AI processors requires adaptive, easy to deploy, and high-density power packaging modules. The latest AI processor power packaging module launched by Changdian Technology (600584) can provide a comprehensive optimized solution for the power performance, distribution efficiency, heat dissipation capacity, system cost and size of high-performance computing chips, to meet the growing power demand, and enable the new high-voltage and high-density power packaging architecture to better support the development needs of future AI and high-performance computing.

Changdian Technology has currently provided a packaging solution for leading power suppliers in the industry that efficiently combines bus converters and multiphase power modules. High voltage packaged distribution networks can achieve the advantages of high efficiency, low cost, small size, and lightweight. The innovative design of this high-density power supply module is like jet fuel for airplanes, ensuring that multi-core AI processors operate at appropriate clock frequencies, significantly improving performance.

The innovative design of the high current power supply module by Changdian Technology integrates the magnetic components of the distribution converter into the three-dimensional module, and directly assembles the energy storage inductor or transformer into the power transmission module, greatly improving power supply performance and efficiency. This allows host engineers to reduce the occupied area of power units in their entire system and quickly increase power density.



These high-density three-dimensional power distribution modules can be flexibly deployed on the motherboard near the processor, greatly reducing the resistance of the power supply network to tens of microohms. This not only reduces energy loss, but also reduces the number of processor power pins, achieving higher current density, power density, and faster transient response performance. This type of multi-phase load point (PoL) power supply packaging solution provides system level innovation opportunities for AI chip manufacturers.

Changdian Technology stated that if high-power AI computing centers do not adopt advanced three-dimensional power supply packaging technology, the number of voltage conversion devices may exceed and overflow the size of circuit boards, making it impossible to ensure neat and optimized hardware system assembly; It is also possible that the signal integrity cannot be guaranteed due to high power noise. From the application of high-voltage distribution technology to innovative packaging architecture and topology, it is the new generation AI processor power supply solution provided by Changdian Technology that helps high-performance computing chips better meet the growing power demand.
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